Descripción general de la empresa - Wenzhou Yixing Electronics Technology Co., Ltd.

7YRSWenzhou Yixing Electronics Technology Co., Ltd.

Solder paste printing

Its function is to leak solder paste or patch adhesive onto PCB's solder pad

SMT

Its function is to install surface assembly components accurately to the fixed position of the PCB

reflow soldering

Its function is to melt the solder paste, make the surface assembly components and PCB board firmly stick together

manual insertion

insert by hand

wave-soldering

The welding surface of the plug-in plate is directly in contact with high temperature liquid tin for the purpose of welding.

Nombre	No	Cantidad	Verificado

Surface Mount System	Sumsung & CP45FV	2
Reflow Soldering	ANTOM & SOLSYS-83101RTP	1

Verificado

Tamaño de la fábrica	1,000-3,000 square meters
Ubicación de la fábrica	Second Floor, No. 29, Changwen Road, Shacheng Sub District,Economic Development Zone,Wenzhou City,Zhejiang Province, China
N° de líneas de producción	4
Fabricación por contrato	OEM Service Offered, Design Service Offered, Buyer Label Offered
Valor de producción anual	US$1 Million - US$2.5 Million

Línea de producción	Supervisor	NO, de los operadores	NO, de en-línea QC/QA	Verificado

Verificado